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| HS Code | 860777 |
| Chemical Composition | Polyamide polymer containing repeating amide groups |
| Common Types | PA6, PA66, PA11, PA12, PA610, PA612 |
| Appearance | White to light yellow translucent or opaque pellets |
| Density | 1.01-1.15 g/cm3 |
| Melting Point | 178-265 °C |
| Glass Transition Temperature | 40-80 °C |
| Water Absorption | 0.5-10% |
| Tensile Strength | 40-85 MPa |
| Elongation At Break | 20-300% |
| Flexural Modulus | 1.0-3.5 GPa |
| Notched Izod Impact Strength | 50-120 J/m |
| Thermal Deformation Temperature | 60-190 °C |
| Continuous Service Temperature | 80-150 °C |
| Dielectric Strength | 15-25 kV/mm |
| Volume Resistivity | 10^12-10^15 ohm-cm |
| Chemical Resistance | Good resistance to hydrocarbons, oils, and many solvents; poor resistance to strong acids and phenols |
| Coefficient Of Friction | 0.1-0.4 |
| Abrasion Resistance | Good to excellent |
| Flammability | Self-extinguishing or flame-retardant grades available |
As an accredited Polyamide Resin (PA Resin) factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaging: Polyamide Resin (PA Resin) supplied in 25 kg polyethylene-lined multi-wall paper bags or woven sacks, palletized for shipping. |
| Container Loading (20′ FCL) | Polyamide Resin (PA Resin) loaded into a 20-foot FCL dry container, palletized or bagged, securely stowed within weight limits. |
| Shipping | Polyamide Resin (PA Resin) is typically shipped as pellets, granules, or powder in sealed multi-wall bags, FIBCs, or drums. It is generally non-hazardous but should be kept dry, cool, and away from direct sunlight, moisture, and ignition sources. Use covered transport; avoid dust generation and static buildup. |
| Storage | Store Polyamide Resin (PA Resin) in a cool, dry, well-ventilated area away from direct sunlight, heat, moisture, and ignition sources. Keep containers tightly closed to prevent moisture absorption and contamination. Separate from strong oxidizers, acids, and bases. Maintain temperatures below 30°C, avoid static buildup, follow local regulations, use proper labeling, and inspect containers regularly. Protect from physical damage. |
| Shelf Life | Typically 12–24 months in original, unopened packaging stored cool, dry, away from moisture, heat, and sunlight; PA resin absorbs moisture. |
In a 40 wt% solids ethanol/n-propanol/n-propyl acetate varnish, alcohol-soluble polyamide resin is dissolved at 55 °C under closed-lid high-shear agitation in a jacketed disperser equipped with vapour extraction; batch temperature is held below 60 °C because solvent loss above this point produces a non-linear increase in varnish viscosity. The resin grade selected for surface-print polyethylene and BOPP work typically exhibits an amine value of 2–5 mg KOH/g by ASTM D2074-07 and a ring-and-ball softening point of 105–115 °C by ASTM E28-18. In final liquid ink, the polyamide resin addition ratio is 8–15 wt% for pigmented white concentrates and 15–25 wt% for clear overprint varnishes and low-pigment inks; above 25 wt%, the resin develops an entangled elastic network under press shear, and a controlled-stress rheometer records a phase-angle increase from 68° to 81° at 1 Hz after bead-mill processing. Ink is manufactured on a horizontal bead mill charged with 0.8–1.2 mm yttrium-stabilized zirconia beads, with mill residence of 20–40 min at 40–45 °C; letdown adjusts print viscosity to 25–35 s through Zahn Cup #3 at 25 °C. For compliance, the dried print on the non-food-contact side is evaluated under FDA 21 CFR 175.300 or 175.105 depending on the functional barrier structure; for EU packaging, migration validation follows EU Regulation 10/2011/EC Annex II overall migration limits, and ink production follows the EuPIA Good Manufacturing Practice guideline. Terminal printed articles include surface-printed BOPP snack wrappers, polyethylene bread bags, and pearlized BOPP labels, where the binder maintains adhesion to corona-treated polyolefin surfaces with dyne levels of 38–42 mN/m. Press-side viscosity drift is observed when ambient relative humidity exceeds 60 % because the ethanol-rich solvent system absorbs moisture; addition of 5–10 wt% n-propyl acetate is used instead of ethanol to avoid a slower dry rate.
| Requirement | Designation | Control value or condition |
|---|---|---|
| Food-contact coating compliance, US | FDA 21 CFR 175.300, 175.105 | Finished print on non-contact side or behind functional barrier |
| Overall migration limit, EU plastics | EU Regulation 10/2011/EC Annex II | 10 mg/dm² |
| Residual solvent in laminate | EN 13628-1:2002 | < 5 mg/m² |
| Adhesion to corona-treated BOPP | ASTM D3359 Method B | Not worse than 4B |
Heat-seal lacquers formulated with alcohol-soluble polyamide resin are coated onto aluminium foil lidding and polyester barrier films by reverse gravure coating at 80–180 m/min. The polyamide resin content in dried coating solids is normally 20–35 wt%, balanced with nitrocellulose or vinyl chloride-vinyl acetate copolymer, antiblocking particles, and slip additives. At 20–25 wt% polyamide resin on 20 µm aluminium foil, seal initiation temperature is 105–120 °C at 0.3 MPa seal pressure and 0.5 s dwell; above 35 wt%, seal initiation temperature shifts upward by 5–8 °C because the lacquer film cannot flow quickly into the seal-jaw interface. The drying tunnel uses three zones: 60 °C, 80 °C, and 95 °C; residual solvent is kept below 5 mg/m² by headspace gas chromatography according to EN 13628-1:2002. For pharmaceutical lidding, migration testing follows EU Regulation 10/2011/EC and Ph. Eur. 3.2.2 or USP <661.1>; for food lidding, the coating is assessed under FDA 21 CFR 175.300 and 21 CFR 177.1390 when polyester film is part of the composite. Terminal forms include die-cut aluminium lidding for dairy cups, heat-sealable paper lids for portion cups, and child-resistant polyester blister lidding. On production coaters, dry coat weight above 4.0 g/m² can cause roll-blocking during warehouse storage because the polyamide resin remains soft at 40 °C; rewind tension is therefore held at 60–80 N/m and rewind core temperature is kept below 25 °C.
Dimer fatty acid-based reactive polyamide resins function as room-temperature hardeners for DGEBA-type epoxy resins in anti-corrosion primers, concrete coatings, and structural adhesives. A standard reactive polyamide with amine value 300–360 mg KOH/g and active hydrogen equivalent weight 100–120 is mixed with liquid epoxy resin having epoxide equivalent weight 180–190 at 50–70 phr; high-viscosity grades are mixed at 40–60 phr. The two-component system is applied by plural-component airless spray at 2:1 to 4:1 pump ratio after an induction time of 15–30 min; pot life at 25 °C is 45–90 min to double viscosity under ASTM D2196-20. The coating cures to hard film within 6–12 h at 23 °C by ASTM D5895-03 and reaches full chemical resistance after 7 d. Adhesion to blast-cleaned steel prepared to Sa 2½ per ISO 8501-1 is not less than 5 MPa by ASTM D4541-17; salt spray exposure under ISO 9227:2017 for 500 h should not produce scribe creep beyond 2 mm. Compliance is anchored to REACH Regulation (EC) No 1907/2006 registration, RoHS Directive 2011/65/EU for electrical components, and FDA 21 CFR 175.300 where the cured film is part of food-contact equipment if migration tests are completed on the final formulation. Finished parts include steel bridge maintenance primers, tank lining intermediate coats, and concrete floor coatings. Operational boundary: substrate temperature below 10 °C retards cure sufficiently that full cure can exceed 14 d; condensation on the steel surface before gelation causes amine blush and must be removed by washing with warm water before overcoating.
| Property | Test method | Typical control value at 23 °C |
|---|---|---|
| Mix ratio with liquid epoxy resin, EEW 180–190 | Supplier stoichiometry | 50–70 phr |
| Pot life to double viscosity | ASTM D2196-20 | 45–90 min |
| Dry through time | ASTM D5895-03 | 6–12 h |
| Pull-off adhesion to Sa 2½ steel | ASTM D4541-17 | ≥5 MPa |
| Salt spray resistance, scribe creep after 500 h | ISO 9227:2017 | ≤2 mm |
Low-pressure moulding and hot-melt assembly grades use high molecular weight polyamide resin with controlled dimer acid content to set crystallization rate and melt viscosity. In a melt tank at 160–190 °C, melt viscosity measured by ASTM D3236-15 with a Brookfield Thermosel and spindle SC4-27 at 20 rpm is typically 2,000–6,000 mPa·s; when viscosity falls below 2,000 mPa·s, the adhesive wets porous substrates faster but shows lower initial loop tack and greater vertical sag. Polyamide resin addition ratio as base polymer is 60–100 wt%, with the balance comprising rosin ester or hydrocarbon tackifier and paraffin wax for open-time control. Adhesive forms are produced on a twin-screw extruder with L/D ratio 40:1 and strand pelletizer, or by cryogenic grinding into powder for textile lamination. Low-pressure moulding grades are processed through heated hoses and nozzles at 180–200 °C and injection pressures of 0.5–5.0 MPa; the resin crystallizes at 110–130 °C, reducing cycle time but producing cold-joint defects if mould temperature is below 15 °C. Compliance includes UL 94 flame classification on the final overmoulded component, RoHS Directive 2011/65/EU, and REACH registration. Terminal articles include automotive wire harness strain reliefs, cable connectors, filter end caps, and electronic sensor housings. Thermal oxidative degradation is the main processing limit: melt tank residence above 8 h at temperatures over 200 °C increases viscosity and yellows the resin due to dimer acid unsaturation; nitrogen blanketing or vacuum drying at 80 °C for 4 h is specified when storage humidity exceeds 60 % RH.
Alcohol-soluble polyamide resin as a co-binder in paper and board overprint coatings is applied at 10–20 wt% of total coating solids in a nitrocellulose-based varnish; the dry coat weight is 1.0–2.0 g/m². The coating is applied on flexographic or gravure stations and dried at 50–70 °C, with alcohol/PET solvent traps recovering the vapour stream. The resin addition improves surface wetting on clay-coated SBS board and reduces fibre raise at the printed carton surface. For food packaging, compliance is evaluated under FDA 21 CFR 176.170 for paper and paperboard in contact with aqueous and fatty foods, together with EU Regulation 1935/2004/EC; migration data for this specific overprint configuration is limited and must be generated on the finished carton structure. Terminal articles include pharmaceutical folding carton varnish, gift box exterior lacquer, and paper cup outer-surface coating.
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Polyamide resin (PA resin) comprises a family of semicrystalline or amorphous polymers whose repeating units contain amide linkages formed by ring-opening polymerization of lactams or by condensation of diamines with dibasic acids. The designation system in ISO 1874-1 encodes polymer type, viscosity number, and the presence of glass-fiber or impact-modifier packages; a commercial “model” is therefore a specification class rather than a single molecular structure. Melt-processable grades such as PA 6, PA 66, PA 11, PA 12, PA 6/66, and semiaromatic PA 6T/66 are specified by density, melt volume-flow rate, tensile modulus, notched impact, and moisture uptake. Dimer acid-based PA resins used in flexographic inks, laminating adhesives, and epoxy curing are specified by amine value, acid value, active hydrogen equivalent weight, solution viscosity, and softening point. Major applications include injection-molded automotive parts, extruded film and tubing, hot-melt adhesives, and solvent-borne binder systems.
Differences from epoxy, polyester, polyurethane, and ethylene-vinyl acetate systems arise from the amide group’s hydrogen-bonding capacity and from the low solubility parameter of the hydrocarbon dimer segments. In flexible packaging lamination, a non-reactive dimer acid PA binder is typically applied from ethanol/n-propyl acetate solutions at 35–45 % solids and exhibits higher gel structure after solvent release than a high-molecular-weight polyester, but lower aromatic solvent resistance than a bisphenol-A epoxy. Laminate bond strength after solvent dilution is tested under ASTM F904-21, and PA binders are used where the observed failure mode is film tear rather than adhesive peel. For hot-melt assembly, PA-based adhesives are formulated with waxes, tackifiers, and plasticizers; open time is controlled by softening point and melt viscosity rather than by the thixotropic index used in epoxy pastes. The PA system is preferred where adhesion to corona-treated polyolefins and aluminum foil must survive low-temperature flexing, whereas the epoxy is preferred where hardness and high-temperature structural shear dominate.
Both PA 6 and PA 66 with 30 % glass fiber are candidates for air-intake manifolds, radiator end tanks, and engine covers. The lower melting peak of PA 6 at 220–225 °C under ISO 11357-3:2018 permits melt temperatures of 240–270 °C, while PA 66 typically requires 270–300 °C. The constraint is thermal performance: unfilled PA 66 has a melting peak of 255–265 °C and a heat deflection temperature near 75–90 °C at 1.8 MPa under ISO 75-2:2013, roughly 10–15 K above PA 6. After conditioning at 23 °C and 50 % relative humidity, the tensile modulus difference narrows because PA 6 absorbs 2.7–3.0 % moisture and PA 66 absorbs 2.3–2.8 % under ISO 62:2008. In continuous coolant contact above 120 °C, PA 6 parts can exhibit earlier creep. Injection molders report that PA 6 often requires a nucleating package and higher mold temperature to keep post-mold shrinkage below 0.5 % when dimensional tolerance is critical. Published data for specific manifold geometries is limited, but the measured heat deflection gap appears consistently in unfilled and glass-filled grades.
The following table summarizes typical unfilled property ranges reported in supplier data sheets rather than a single production lot. Test designations refer to the applicable ISO method.
| PA family | Density | Melting peak | Tensile modulus | Equilibrium moisture at 23 °C/50 % RH |
|---|---|---|---|---|
| PA 6 | 1.13–1.15 g/cm³ | 220–225 °C | 2.7–3.2 GPa | 2.7–3.0 % |
| PA 66 | 1.13–1.15 g/cm³ | 255–265 °C | 2.9–3.6 GPa | 2.3–2.8 % |
| PA 12 | 1.01–1.03 g/cm³ | 175–180 °C | 1.2–1.5 GPa | 0.7–1.0 % |
For glass-fiber-reinforced grades, the designator GF30 or GF50 identifies nominal glass mass fraction. The corresponding tensile modulus shifts upward by roughly 2.0–3.0 GPa at 30 % glass content, but anisotropic shrinkage and weld-line strength become process-limiting factors in complex geometries. Compared with acetal and PBT, unfilled PA 66 has higher tensile strength and heat deflection temperature than acetal but higher moisture absorption than PBT. PBT is specified when humid-ageing dimensional stability and fast crystallization are primary; acetal is specified for low coefficient of friction and low moisture uptake; PA 66 is specified for higher continuous-use temperature and load-bearing capability in glass-reinforced parts. The substitution boundary is not set by unfilled density, because all three have similar density, but by the moisture shift in stiffness under ISO 1110:2019 accelerated conditioning.
Before melt processing, PA resin must be dried to 0.10–0.20 % moisture or less to prevent hydrolysis-induced molecular weight loss. Desiccant dryers with a dew point below −40 °C are operated at 80 °C for PA 6 and 80–100 °C for PA 66 for 4–8 h; residence times beyond 12 h at elevated temperature can produce yellowing. Extruders used for compounding are typically configured with 24:1 to 36:1 L/D and vacuum venting to remove residual water and caprolactam monomer. On production lines, moisture is verified by ISO 15512:2019 before startup. For glass-filled PA 66, melt-temperature excursions above 300 °C or screw recovery times longer than 60 s can generate black specks and odor. Supplier processing guides consistently list upper melt-temperature limits, but barrel-temperature profiles for specific part geometries are frequently proprietary.
On a twin-screw compounding line, glass-fiber-reinforced PA 66 is usually produced with a corotating intermeshing twin-screw extruder having a L/D ratio of 40:1 to 48:1. Glass roving is fed downstream into the melt to limit fiber breakage; screw speeds of 300–600 min⁻¹ and specific mechanical energy input of 0.20–0.35 kWh/kg are common for 30 % glass loading according to equipment manufacturer guidance. In high-throughput operation, fiber attrition reduces number-average fiber length from the initial chopped-strand length to 200–400 µm, which lowers notched impact but improves surface appearance. Production operators monitor melt pressure before the die; a pressure increase beyond 30 % of baseline over an 8-hour campaign indicates filter-pack accumulation of degraded gel particles. The compounded pellets are dried and sealed in moisture-barrier packaging because PA 6 and PA 66 regain moisture rapidly in warehouses where relative humidity exceeds 60 %.
Representative specification bands for dimer acid-based PA resins are listed below. Brookfield viscosity is measured at 25 °C under ASTM D2196-20; amine value is determined under ASTM D2074-07.
| Dimer acid PA class | Softening point | Amine value | Active hydrogen equivalent weight | Brookfield viscosity at 25 °C |
|---|---|---|---|---|
| Non-reactive gel grade | 90–110 °C | ≤5 mg KOH/g | Not applicable | 50–150 mPa·s |
| Standard reactive amidoamine | 60–90 °C | 80–150 mg KOH/g | 150–180 g/eq | 10–30 Pa·s |
| High-amine polyamide | 40–70 °C | 330–450 mg KOH/g | 60–100 g/eq | 3–15 Pa·s |
Reactive PA resins follow a different formulation logic from solvent-borne non-reactive grades. A dimer acid-based reactive polyamide used as an epoxy curing agent may carry an amine value of 80–400 mg KOH/g and an active hydrogen equivalent weight of 60–180 g/eq. Stoichiometry is calculated from the epoxy equivalent weight of the companion resin; a deviation of ±5 % from the amine hydrogen equivalent weight shifts the cured network from a flexible high-elongation solid to an undercrosslinked material with reduced lap shear. Addition of 2.5 wt% of a tertiary amine accelerator can reduce gel time by more than 50 %, but ambient humidity can cause surface blush. Cured PA-epoxy films generally show lower hardness and higher elongation than bisphenol-A epoxy systems, making them suitable for bonding flexible substrates where lap shear is tested under ASTM D1002-10 and T-peel under ASTM D1876-21.
PA 6 and PA 66 blown or cast films are specified where oxygen and aroma barrier, toughness, and thermal resistance are required in multilayer food packaging. Cast PA 6 film processed with a chill-roll temperature of 20–40 °C has an oxygen transmission rate roughly two orders of magnitude lower than low-density polyethylene at the same thickness, but substantially higher than ethylene-vinyl alcohol. Barrier data are expressed under ISO 15105-2:2002 for oxygen and ISO 15106-3:2017 for water vapor transmission. In retort pouches, the PA layer is combined with polypropylene by adhesive lamination because the PA layer prevents flex-crack pinholes and provides thermal resistance during retort at 121 °C for 30 min. The difference from polyester film is mainly impact toughness and flex-crack resistance, while polyester provides higher stiffness and better inherent printability.
PA 12 is selected when the service envelope includes impact below −40 °C, fuel vapor contact, and low moisture uptake. The material has a melting point of 175–180 °C, density of 1.01–1.03 g/cm³, and equilibrium moisture absorption below 1.0 % at 23 °C and 50 % relative humidity under ISO 62:2008. Dimensional change between dry-as-molded and conditioned service is therefore smaller than for PA 6 or PA 66. In automotive quick connectors, PA 12 is processed at melt temperatures of 210–250 °C and mold temperatures of 30–60 °C, reducing thermal degradation risk in multicavity hot-runner tools. A key difference is low-temperature notched impact under ISO 179-1:2010; PA 12 retains ductile failure at lower test energy than many PA 66 grades. However, PA 12 has lower tensile modulus and lower heat deflection temperature than PA 66, so it does not replace PA 66 when underhood continuous-use temperature exceeds 100 °C. Fuel-contact grades are qualified against SAE J2260 or OEM-specific permeation tests; published data for specific fuel blends with ethanol above 10 vol% remain limited.
Regulatory qualification depends on the final article. PA resins for food-contact articles are evaluated under 21 CFR 177.1500 for nylon resins, 21 CFR 175.105 for adhesives, or 21 CFR 175.300 for resinous and polymeric coatings. In the European framework, migration testing follows Regulation (EU) No 10/2011 with food simulants, and REACH registration is required under Regulation (EC) No 1907/2006. A supplier declaration of compliance must list monomer composition and residual processing aids because PA resins may contain residual caprolactam, hexamethylenediamine, or dimer acid fractions. For retort packaging, extraction under actual time–temperature conditions must be verified by the converter; published data for multicomponent laminates with PA barrier layers is limited because migration depends on layer thickness, tie-layer type, and sealing conditions.
